WS-EDCO-H-30 diamond tooling for EDCO Dual Prep: Hard bond, #30, Double rectangle, recommended for Rental fleet prep. Use this page to compare fit, bond, grit, and QC checks before requesting a quote.
| Field | Value |
|---|---|
| SKU family | WS-EDCO-H-30 |
| Tooling system | EDCO compatible |
| Bond | Hard |
| Grit | #30 |
| Segment shape | Double rectangle |
| Compatible machines | EDCO Dual Prep |
| Recommended floor / application | Mohs 1-2 / Rental fleet prep |
Send a machine and plate photo for the first order, especially when replacing OEM-style tooling.
Ask for segment height, label, quantity, and packing mark checks before shipment.
Use the Bond Selector if floor hardness is uncertain before ordering this SKU.
This SKU is intended for EDCO Dual Prep or compatible plates using EDCO compatible tooling.
Hard bond with #30 is recommended for Rental fleet prep where the floor condition matches Mohs 1-2.
Confirm machine model, plate photo, bond, grit, quantity, and whether QC proof is required before shipment.